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8 Fenner, M, Solder Paste for No Clean Reflow, Soldering and Surface Mount Technology, No 13, February 1990 9 Bandyopadhyay, N, Marczi, and Adams, S, Manufacturing Considerations for a No Clean NoResidue Soldering Process, SMART VI, Orlando, 1990, pp 398 415 10 Ivankovits, J C, and Jacobs, S W, Atmosphere Effects on the Solder Reflow Process, Proceedings of SMTCON, Atlantic City, 1990 11 Arslancan, A N, IR Solder Reflow in Controlled Atmosphere of Air and Nitrogen, Proceedings of NEPCON West 90, Anaheim, 1990 12 Keegan, J, Lowell, N C, and Saxeena, N, Solder Joint Defect Analysis for Inert Gas Wave Soldering, Proceedings of NEPCON West, 1992, pp 672 690 13 de Klein, F J, Open vs Closed Reflow Soldering, Circuits Assembly, April 1993, pp 54 57 14 Morris, J R, and Bandyopadhyay, N.

, No-Clean Solder Paste Reflow Process, Printed Circuits Assembly, February 1990, pp 26 31 15 Lea, C, Inert IR Reflow:The Significance of Oxygen Concentration of the Atmosphere, Proceedings of Surface Mount International, San Jose, August 1991, pp 27 29 16 Van Nostrand s Scientific Encyclopedia, 4th ed, D Van Nostrand Co, Inc, 1966, p 870 17 Weast, R C, Handbook of Chemistry and Physics, 49th ed, Chemical Rubber Co, p D 58 18 Arnow, L E, and Reitz, H C, Introduction to Organic and Biological Chemistry, CV Mosby Company, 1943, p 182 19 Hartmann, H J, Soft Soldering under Cover Gas: A Contribution to Environmental Protections, Elecktr Prod und Prftechnik, 1989, H 4, s37 39 20 Idem, Nitrogen Atmosphere Soldering, Circuits Assembly, January 1991 21 Iman, R, et al.

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, Evaluation of a No-Clean Soldering Process Designed to Eliminate the Use of Ozone Depleting Chemicals, IWRP CRADA No CR91 1026 22 Disbon, G, and Bobbio, S M, Fluxless Soldering Process, US Patent No 4,921,157, May 1, 1990 23 Pickering, K, Southworth, C, Wort, Parsons, A, and Pedder, D J, Hydrogen Plasmas for Flux Free Flip-Chip Solder Bonding, Journal of Vacuum Science and Technology, Vol A, No 8(3), May-June 1990, pp 1503 1508..

There have been many soldering methods devised over the millennia. The most ancient are the soldering torch and the soldering iron, but they are inadequate for assembling today s densely populated printed circuit boards. These are both directed-energy bonding methods, where the heating is localized to a specific small piece of board real estate to accomplish soldering of one or a localized set of joints. Oven reflow or wave soldering are examples of mass soldering techniques, where an entire circuit board is soldered simultaneously (or sequentially in the case of wave soldering). These techniques encompass a much larger area of heating than was possible by the iron.Thus, today s techniques can be divided into categories according to area of heating or number of joints formed simultaneously. Soldering techniques must be judged by their applicability, cost, and end result. Mass soldering techniques are by far the most common for high-volume circuit board assembly. Some of the directed-energy soldering methods are now catching on in volume manufacturing.

The mass flow or reflow methods are suited for high-volume manufacturing. The entire board is heated and large numbers of components on the board are soldered simultaneously. The two most common of these methods are oven reflow soldering and wave soldering. A third technique, vapor phase reflow soldering, has dwindled in popularity due to environmental concerns regarding the use of the chlorofluorocarbon-based solvents that were key to this process. Now, however, perfluorocarbons are substituted and the technique is still in use. The choice of soldering method is dictated by the types of components and boards being soldered, the required throughput rate, and requisite solder-joint properties. There are no clear-cut rules. Once the exclusive domain of wave soldering, some plated-through hole (PTH) components are being assembled along with surface-mount components in reflow ovens. Conversely, some surface-mount components are bonded by wave soldering.

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