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heaters and boards from the external (room) environment just as much as it is designed to preserve thermal conditions as prescribed by the process and demanded of the heaters. Boards are moved through the tunnel and past multiple heaters by an adjustable constantspeed conveyor permitting controlled and gradual preheating, reflow, and post-reflow cooling of the circuit board. Consideration of tunnel dimensions is critical for the reflow application. Short tunnel ovens may not permit a profile adequate for attaining prescribed reflow temperature-versustime profiles for larger, thermally massive PCB assemblies. Tunnel height dimensions must also be adequate to accommodate the tallest components or component heat sinks. Tunnel width will limit the size of the board that can be introduced to it. 47.3.1.2 Conveyors. There are two main conveyor systems used in reflow ovens: pin-chain and mesh belt. One is required and both are recommended for any reflow machine. 47.3.1.2.1 Pin-Chain Conveyor. The pin-chain conveyor, also known as an edge-hold conveyor, looks like a bicycle chain with a pin protruding inward from evenly spaced links, as shown in Fig. 47.2.

There is one such chain on each side of the reflow oven.The circuit board rests on these pins on the inner aspect of the chains and is transported through the oven during the soldering process. The two chains are driven from a common motor, appropriately geared to ensure that the circuit board is conveyed through the oven evenly and to preclude angling and jamming of the board in the oven. Conveyor speed is adjustable and is one of the major factors of reflow soldering in the thermal (time-versus-temperature) profile development. Pin-chain conveyors are best for circuit boards with components on both sides since the circuit board is conveyed by its edges. This edge-hold method prevents misregistration of parts to be reflowed and also eliminates movement of or mechanical interference with previously reflowed components on the bottom side of the board during transport through the oven.

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Of course, an edge keep-out area must be designed into the board such that there will be no pin-chain or component interference When reflowing thin, large circuit boards, they may sag when held by the edges on a pinchain conveyor The sagging is due to thermal excursion above the glass transition temperature (Tg) of the circuit board epoxy during the reflow process Tg is the temperature at which a partially crystalline polymer will change from a hard structure to a rubbery, viscous state, as in the case of FR-4 and other such laminate materials The Tg of most circuit board laminates is in the range of about 135 C to about 200 C, well below the peak reflow process temperatures of most solders Sagging will be pronounced due to the fact that the board is unsupported at its middle as it surpassed its Tg during transport on the pin-chain conveyor.

The simplest ADC can be built with the AVR processor by using the on-chip analog comparator together with either a timer or even a counter (See Figure 611) Figure 612 illustrates a rather crude ADC using the on-chip analog comparator The comparator compares the voltages on the ve input Ain0 and the ve input Ain1 and if the Ain0 voltage is greater (ie, more positive) than the Ain1 voltage, the output of the comparator ACO is set to 1 The ACO output is directly readable as a bit in the ACSR register The simple ADC in Figure 612 works as follows To begin with, the PB0 pin is set to logic 0 This discharges any charge on the capacitor.

Copper ground and power planes within the board provide significant support, but may not impart enough stiffness to counter this problem Sagging alone or together with rail-to-rail nonparallelisms at process temperature can even lead to boards falling off the conveyor Most of the major vendors in the reflow oven market have conquered the rail twist problem, but hot testing an oven with precisely toleranced test vehicles or even aluminum plates should be performed prior to final acceptance of the equipment or reliance on it Board sagging can be mitigated, to some extent, by means of mechanical stiffeners affixed permanently or temporarily to the circuit board or by reflowing the board on a pallet It should be noted that stiffeners and pallets may affect the thermal mass of the board, making reflow more of a challenge.

The thrust load is supported by an aerostatic thrust bearing while the radial load is supported by an aerostatic journal bearing Normally, the whole shaft is divided into two halves to be supported, one aerostatic bearing on each half The shaft will be integrated into the rotor to form an integral spindle Two rows of eight simple orifices are needed to support the required load capacity and stiffness One row may be sufficient if the load is light and the L/D ratio is small The pressure distribution for the single row and two rows feeding are shown in Figure 74 The half station feeding is also known as single row feeding The one-eighth feed station is not used because of its excessive airflow and less rigidity The one-fourth feed station supports the required load and stiffness with a suitable airflow Therefore, at the quarter station, two feed rows are chosen ahead of the half station or the one-eighth station

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