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19 Funk and Wagnalls, New Encyclopedia, Bearings, Volume 13 20 Husig, A, Linke, T and Zimmermann, C, Effects from supercritical ship operation on inland canals, Journal of Waterway, Port, Coastal and Ocean Engineering, 2000 21 Aeroco, The Air Cushion Principle <http://wwwaerococoza/pinfo_aircushionprinciplehtml> 22 MBDA Corporate Communications, EXOCET AM39: Anti-surface air launched anti-ship missile, 2004 23 Wikipedia, Exocet, <http://enwikipediaorg/wiki/exocet> 2005 24 Geraghty, P, Carlisle, K and Hale L, Ultra-Precision Machine Spindle Using Porous Ceramic Bearings, TechBase 25 Colibri Spindles Ltd, Colibri Air-Bearing Spindles, Manual Book 26 Toshiba Machine Co Ltd, High Precision Aspheric Surface Grinder, 2002 27 Moore Precision Tools, Nanotechnology Systems, 2001 28 Precitech Precision, Nanoform 350 Technical Overview and Unsurpassed Part Cutting Results 2001 29 Moore Precision Tools, Multi-Configuration Deterministic MicroGrinding Attachment, Moore Nanotechnology Systems 30 Munson, BR, Young, DF and Okiishi, TH, Fundamentals of Fluid Mechanics, John Wiley and Sons, Inc, 1998 31 Shires, GL and Pantall, D, The Aerostatic Jacking of a Vented Aerodynamic Journal Bearing, Institution of Mechanical Engineers, Lubrication and Wear Group Convention, May 1963 32 Dudgeon, EH and Lowe, IRG, A Theoretical Analysis of Hydrostatic Gas Journal Bearing, National Research Council of Canada, Mech Engineers Report No MT-54 33 Robinson, CH and Sterry, F, The Strength of Pressure-fed Air Lubricated Bearings, Parts 1 and 2, AERE Reports ED/R 1672 and 1673, 1958 34 Pink, EG and Stout, KJ, Characteristics of orifice compensated hybrid journal bearing, 8th International Gas Bearing Symposium, 1981 35 Shapiro, V Computer-aided Design of Externally Pressurized Bearings, The Institution of Mechanical Engineers, , 1971 36 Stansfield, FM, Hydrostatic Bearings for Machine Tools and Similar Applications, The Machinery Publishing Company, 1970 37 Weck, M, Handbook of Machine Tools, John Wiley, 1984 38 Engineering Science Data Unit (ESDU), General Guide to the Choice of Journal Bearing Type Item 65007, Institution of Mechanical Engineers, London, 1965.

Oven reflow is primarily used for surface-mount component soldering. To prepare a board for this process, solder paste is deposited and then forced through a metal stencil by either a metallic or polymeric squeegee. The paste contains both solder flux for preparing the metal surfaces for solder attachment and sufficient solder for joint formation. Components are placed in the solder paste on the board and the populated printed circuit board (PCB) is inserted into a conveyorized reflow oven. The oven is set to raise the circuit board and component temperatures gradually. Flux in the solder paste activates with the increase in temperature and strips metal surfaces on the components, board, and solder of oxides that inhibit solder joint formation. Finally, enough heat is imparted for the solder to flow (meaning to liquefy, also known as reflow). When built and implemented properly, the oven reflow process results in a controlled and predictable heating and cooling cycle and reproducible solder-joint formation. Rapid heating of the paste is widely known to be a source of solder ball formation. Solder balls (isolated spheres of solder not necessarily connected to the solder mass of the joint) can be problematic for printed circuit board assemblies. They can induce electrical shorts, especially with finer-pitch components where solder ball diameters may be on the order of component lead or printed wiring board (PWB) pad spacing. Solder paste heating rates must be controlled to preclude solder ball generation. Similarly, the soldering time-temperature profile must be carefully adjusted to prevent excessively high temperatures that can cause flux charring or caramelizing and solder-joint degradation. The circuit board itself may also fall victim to the reflow process and deteriorate if temperatures are not maintained properly or evenly. It is for this reason that much equipment development has ensued.

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Reflow Oven Subsystems Even the simplest reflow ovens consist of several subsystems: insulated tunnel, board conveyor, heater assemblies, cooling, and venting (see Fig. 47.1).

FIGURE 47.1 Cross-sectional view of reflow oven with top and bottom heater assemblies, cooling module, vent stack, insulated tunnel, and printed circuit assemblies (PCAs) atop motorized conveyor.

Reflow ovens have reached a high level of sophistication, and there are many other items that enhance oven suitability for the manufacturing floor. Those items, beyond the aforementioned reflow oven subsystems, are niceties, accessories, and gimmicks offered by oven manufacturers, but are not discussed in this section; however, those subsystems previously listed are reviewed to impart an understanding of the basics of oven construction and operation as well as the most advantageous configurations. 47.3.1.1 Tunnel. The tunnel is a thermally insulated passage through the length of the oven where the board is heated and cooled for a continuous reflow process. It serves to insulate the

71 72 73 74 What is the difference between a dynamic and a static air bearing What is the difference between orifice bearings and porous media air bearings What are some typical applications of air bearings Sketch an aerostatic work spindle for an ultra-precision turning and grinding machine showing how radial and thrust loads are borne This spindle is mounted on a Z-axis table The bearing has two rows of eight simple orifices at the quarter station, the feedhole diameter being 0005 in (125 m) Sketch this arrangement, explaining why two rows are needed and why a quarter station is preferred to a oneeighth or a half station Also sketch an orifice (restrictor) you would use here

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